UMX-024H1AP Micro USB B 5P Waterproof DIP H3.1
▲Housing: High temperature thermoplastic, Black UL 94V-0.
▲Terminal: Copper Alloy, Gold Flash Plated At Contact Area, Gold Plated At Solded Area, Nickel Underplated Overall
▲Shell-1: Kirsite,Nickel plated
▲Shell-2: Stailess steel
▲Ring: Silicon
▲Epoxy: Epoxy, Black
■Electrical Performance
▲Rated Voltage: 30V AC
▲Rated Current: 1,5Pin: 3.0A Max. 2,3,4Pin: 1.0A Max.
▲Contact Resistance: 30mΩ Max.
▲Insulation Resistance: 100MΩ Min.
▲Dielectric Strength: 100V AC
■Mechanical Performance
▲Insertion Force: 35N Max.
▲Withdraval Force: 8-35N
▲Durability: 10000 Cycles
■Operating Temperature: -25°C To +85°C
■Waterproof: IPX8
|
|
|
|
|
|
|
Product Drawing |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
DIP |
|
|
English Chinese Chinese and English Japanese |
|
|
2018-06-13 |
|
|
REV.A |
|
|
|
|
|
196 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
