AS25F1128MQ-70SIN/AS25F1128MQ-70WIN Reliability Qualification Report for Serial NOR Flash with Pb/Halogen Free (Industrial)
■Device Code
▲AS25F1128MQ-70SIN
■Design Information
▲Design Rule : .65nm technology.
▲Cell Size (6F2) : 0.15um x 0.3um = 0.045um²
▲Chip Size ( with S/L: 60um) : 3,052 mm x 3,320 mm = 12.07mm2
■Wafer Fabrication
▲Foundry : SMIC
▲Technology : 2 Poly / 3 Metal 65nm.
▲Gate Oxide : 44 Å / 156 Å dual gate oxide
▲Gate : n+ / p+ poly + Co-Salicide
▲Metal : W / AlCu
▲Top layer: Passivation UV SiN 6000Å
■Assembly
▲Package: 8pin SOP 208-mils
◆Assembly house: GREATEK
◆Test Location: ChipMOS.
◆Lead frame: SHINKO A-194
◆Molding compound : Sumitom G700
◆Wire Material : TANAKA 4N
▲Package: 8L WSON (6x5x0.85mm)
◆Assembly house: GREATEK
◆Test Location: ChipMOS.
◆Lead frame: A194
◆Molding compound: Sumitomo G700H
◆Wire Material: TANAKA 4N
◆Lead Finish: Pure Tin
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Test Report |
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Please see the document for details |
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SOP;WSON |
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English Chinese Chinese and English Japanese |
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June. 2022 |
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923 KB |
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