Passive-Device-Embedded Flexible Printed Circuit Boards

2022-10-29
● Capacitors, inductors, and resistors were formed in multilayered flexible printed circuit boards (FPCs) utilizing integrated passive device component technology. Capacitors in the range of 36.5-1310 pF were fabricated using an organic dielectric material. Resistors with 0.03-600 kΩ resistance were also formed by etching a metallic thin film of various dimensions. Inductors, designed by the high-frequency structure simulator (HFSS), were formed by the through hole printed circuit technology. It was shown that the electrical properties of these embedded components could be controlled by their circuit design.

Fujikura

Passive-Device-Embedded Flexible Printed Circuit Boards

More

More

Supplier and Product Introduction

More

More

Please see the document for details

More

More

English Chinese Chinese and English Japanese

2008/5/27

200 KB

- The full preview is over. If you want to read the whole 4 page document,please Sign in/Register -
  • +1 Like
  • Add to Favorites

Recommend

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Contact Us

Email: