Finite Element Analysis of a High Power Resistor
■The finite element analysis described in this report was performed to support the conclusions of the Barry Industries' report "Materials Selection for High-Power / High Reliability Resistors", Jack Lackner, May 1995. The device temperatures and subsequent stresses induced during maximum rated power dissipation are presented.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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07 April 1996 |
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288 KB |
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