PCN07-2020 NanEye2D Supply Chain update for 2x2 version
To ensure the continuous improvement and to reinforce the NanEye2D supply chain, ams AG has qualified Xintec for the TSV (Through Silicon Via) process. It is ams intention to use Xintec as the primary source of the TSV process.
●With the introduction of Xintec for the TSV process, a change in the product form is foreseen in the solder bumps which have a rounded shape and will increase the chip stack height. This change also implies an update on the product data-sheet which will reflect the new qualified condition MSL3.
●This is a revision of the PCN05-2018 that was sent on February 26th, 2018. The update includes the following:
■The statement on the changes of material in the product.
■Update of the part number list (2x2 chip versions)
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301190004 、 301190011 、 301190021 、 301200033 、 NE2D_RGB_F2.8_FOV120_SGA FT SE 、 NE2D_RGB_F2.7_FOV90_SGA FT SE 、 NE2D_CHIP_RGB_SGA CON FT SE 、 NE2D_CHIP_B&W_SGA CON FT SE |
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PCN/EOL |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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February 10, 2020 |
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2x2 version |
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PCN07-2020 |
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