PCN05A-2018 (NanEye-PCR-08A) NanEye2D Supply Chain update
2022-10-14
●In order to ensure the continuous improvement and to reinforce the NanEye2D supply chain, ams has qualified Xintec for the TSV (Trough Silicon Via) process. It is ams intention to use Xintec as the primary source of the TSV process.
●With this update, ams has the clear objective to create a more robust, efficient and quality driven NanEye2D supply chain, supporting all customers forecast demands.
●This is an revision of the notification that was sent on February 26th, 2018. The update includes the following:
■the statement on the change of material in the product.
■Update of the part number list (2x2 chip versions are subject to a separate PCN)
●The changes are in Italic font.
★Impact on design
●In 1X4 variation, Xintec solder balls have lower amount of solder material compared to IZM (nominal ball height of 40 um for Xintec compared to 52 um for IZM). However pull test results are PASS for Xintec sample cameras.
●The change in the supply chain includes a change of material. The main changes in material are: •
■RDL (Redistribution layer) changing from Copper to Aluminum •
■Protection of the RDL changing from Overcoat to Solder Mask.
●For the cabled versions no material changes are affecting the outside of the product. All material changes for the cabled versions are inside the product. For the chip versions the change on the outside is the solder mask only.
●MDF (Material Declaration Form) can be obtained on request.
●With this update, ams has the clear objective to create a more robust, efficient and quality driven NanEye2D supply chain, supporting all customers forecast demands.
●This is an revision of the notification that was sent on February 26th, 2018. The update includes the following:
■the statement on the change of material in the product.
■Update of the part number list (2x2 chip versions are subject to a separate PCN)
●The changes are in Italic font.
★Impact on design
●In 1X4 variation, Xintec solder balls have lower amount of solder material compared to IZM (nominal ball height of 40 um for Xintec compared to 52 um for IZM). However pull test results are PASS for Xintec sample cameras.
●The change in the supply chain includes a change of material. The main changes in material are: •
■RDL (Redistribution layer) changing from Copper to Aluminum •
■Protection of the RDL changing from Overcoat to Solder Mask.
●For the cabled versions no material changes are affecting the outside of the product. All material changes for the cabled versions are inside the product. For the chip versions the change on the outside is the solder mask only.
●MDF (Material Declaration Form) can be obtained on request.
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