PCN16-2019 (Change to packing in JEDEC trays) CMV2000 & CMV4000 product family
2022-10-14
●Please be informed that ams AG is introducing JEDEC trays for the packaging of the CMV image sensor families 2000 & 4000. This change is not affecting any product specifications, only the packing form.
●Affected Device / Product Family
■Products: CMV2000 & CMV4000
●Changes will be
■In order to comply with industry standards, ams will introduce JEDEC conform trays for shipments. The comparison between our current version and the JEDEC version is summarized in appendix 1.
●Purpose of Change
The purpose of this change is to achieve the following customer advantages:
■temperature resistance allowing baking at industry standard temperatures (up to 150 °C)
■meeting industry and international standards
■establish standard for safe handling, transport and storage ■more sturdy packaging, better product protection
■fixed outline dimensions for all products
■stackability within the same device
■automated pick & place feasible
■standard handling procedure for subcontractors
●Affected Device / Product Family
■Products: CMV2000 & CMV4000
●Changes will be
■In order to comply with industry standards, ams will introduce JEDEC conform trays for shipments. The comparison between our current version and the JEDEC version is summarized in appendix 1.
●Purpose of Change
The purpose of this change is to achieve the following customer advantages:
■temperature resistance allowing baking at industry standard temperatures (up to 150 °C)
■meeting industry and international standards
■establish standard for safe handling, transport and storage ■more sturdy packaging, better product protection
■fixed outline dimensions for all products
■stackability within the same device
■automated pick & place feasible
■standard handling procedure for subcontractors
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