FURUKAWA Die Attach Film

PublishTime：2022-09-28

Furukawa’s one-stop-manufacturing provide highly reliable and totally well-balanced DDF with original DAF and DC tape. Original technology in AT & FUNCTIONAL PLASTICS DIVISION is development and production of tape for semiconductor field. Based on those technologies such as sheet manufacturing, blending knowhow of high-polymer material, and adhesion control, original die attach film is newly released. Including dicing tape for die attach film, Furukawa electric provides well-balanced products as “AF Series.
●Advantages
■Good warpage performance
■DDS performance
■No void No die shift
■Pick up performance
■No bleed out
●Features
■Die to Substrate
■Die to Die
■Film on Wire (FOW)

Brand of Product：	Furukawa Electric
Part#：	AFN603 、 AFN601 、 AFN303 、 AF Series More Part#
Product Category：	tape More
Application：	More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	10 June,2022
Version Number：
Data Encoding：	PE-064 2206 TR 100
Data Size：	1.1 MB

Data section preview(2pages)

- The full preview is over,the data is 2 pages -

Download

+1 Like
Add to Favorites

Recommend

New Products & Solutions

More>

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits