Prevention of Tin Whisker Growing

PublishTime：2022-08-12

●Tin whisker growing is a phenomenon related mainly to pure bright tin (Sn) terminal finishes. The whiskers may cause shorts between electrical terminals, therefore actions to prevent whisker growing have to be undertaken.A description of tin whisker theory and mitigation practices can be found in the Jedec standard JP002. Be-low measures are based on that standard. Special tests are however not conducted.
●Usage of hot dipped SnAgCu alloys
◆Most Diotec parts are using SnAgCu alloy for terminal finish, which is applied in a hot dip tinning process. After plating, there is an annealing at 150°C for at least 1h. A nickel (Ni) underplating provides additional protection against tin whisker growing. For this reason, SnAgCu alloys with above treatment are preferred terminal finishes for prevention of tin whisker growing at Diotec.
●Matte Sn plating with annealing
◆At this process, matte Sn is applied, without usage of a brightener. After plating, there is an annealing at 150°C for at least 1h. This measures prevent tin whisker growing even at a pure Sn plating. Therefore it is an accepted method for tin whisker prevention.

Brand of Product：	DIOTEC
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Product Category：	More
Application：	More
Data Type：	Technical Documentation More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
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Language：	English Chinese Chinese and English Japanese
Date of Creation：	2022/7/19
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Data Size：	290 KB

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