ALUMINUM ELECTROLYTIC CAPACITORS
◆SURFACE MOUNT TYPE
●The following conditions are recommended for air convection and infrared reflow soldering on the SMD products onto a glass epoxy circuit boards by cream solder. The dimensions of the glass epoxy boards with resist are 90×50×0.8mm for D55 to KG5 case code SMD capacitors and 180×90×0.8mm for LH0 to MN0 case codes SMD capacitors.
●The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.
●Reflow should be performed twice or less. (The only MHS series : 3times or less)
●Please ensure that the capacitor became cold enough to the room temperature (5 to 35°C) before the second reflow and the third reflow (The only MHS series).
◆RADIAL LEAD AND SNAP-IN TYPE
●Recommended soldering heat conditions
★Flow soldering ：260±5°C for 10±1 seconds
★Hand soldering ：380±10°C for 3±0.5 seconds
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J-STD-020 、 AlchipTM MVA 、 MVE 、 MZR 、 MZJ 、 MZA 、 MVY 、 MZF 、 MZE 、 MZK 、 MLA 、 MLF 、 MLE 、 MLK 、 MVL 、 MVJ 、 MHS 、 MVH 、 MHL 、 MHB 、 MHJ 、 MHK 、 MKB |
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/04/21 |
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CAT. No. E1001S |
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180 KB |
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