BGS8424 WLAN LNA+Switch
●The BGS8424 couples good noise figure, linearity, efficiency, low insertion loss. Also the CMOS switches with the process stability and ruggedness are the hallmarks of the SiGe:C technology.
●The BGS8424 has a 1.5 mm × 1.5 mm footprint HX2SON8 package and a maximum thickness of 330 μm.
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Please see the document for details |
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HX2SON8 |
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English Chinese Chinese and English Japanese |
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Apr 9, 2022 |
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