HX426C16FB/16 Memory Module Specifications
■HyperX HX426C16FB/16 is a 2G x 64-bit (16GB) DDR4-2666 CL16 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 1G x 8-bit FBGA components per module. Each module supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Each module has been tested to run at DDR4-2666 at a low latency timing of 16-18-18 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows
●JEDEC/XMP TIMING PARAMETERS
■JEDEC/PnP: DDR4-2666 CL16-18-18 @1.2V
●FEATURES
■Power Supply: VDD = 1.2V Typical
■VDDQ = 1.2V Typical
■VPP = 2.5V Typical
■VDDSPD = 2.2V to 3.6V
■Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
■Low-power auto self refresh (LPASR)
■Data bus inversion (DBI) for data bus
■On-die VREFDQ generation and calibration
■Dual-rank
■On-board I2 serial presence-detect (SPD) EEPROM
■16 internal banks; 4 groups of 4 banks each
■Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
■Selectable BC4 or BL8 on-the-fly (OTF)
■Fly-by topology
■Terminated control command and address bus
■Height 1.340” (34.04mm), w/heatsink
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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06/20/18 |
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4808093-001.B00 |
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302 KB |
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