Declaration for REACH Regulation

2022-07-18
It is anticipated that substances used in our products will be registered by raw material manufacturers within our supply chain. Based on our vendor supplied analyses, we declare that all semiconductor manufactured by EIC SEMICONDUCTOR and their packaging does contain Lead*(Pb) [CAS # 7439-92-1; EC # 231-100-4] in a concentration above 0.1 % w/w. *Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)and contain Lead*(Pb) [CAS #7439-92-1; EC # 231-100-4] in a concentration above 0.1 % w/w. *Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound are exempted from the requirements of Article 4(1) of 2011/65/EU, RoHS2 directive, Annex III, Cl.No.6(C)and hereby certify that its products are in full compliance with all aspects of REACH Regulation (EC) No. 1907/2006 of the European Parliament and of the Council of 18 December 2006, concerning the Registration, Evaluation, Authorization and Restriction of Chemicals (REACH).

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2021.03.31

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