Application Note #006 Wrapped Chip Device Mounting Instructions
Each of the three wraparound configurations is designed for a specific mounting application. As with many surface mount devices, the electrical connections are also used to provide mechanical support. You may use epoxy if additional reinforcement is necessary. Figures 1, 2 and 3 show the typical mounting methods for each part type. The recommended attachment technique for each style is shown in Table 1.
When choosing an attachment technique, the primary concern is to achieve the desired RF performance. The W1, WB1 and W3 designs have been optimized for best performance when mounted according to the above guidelines. The most common use for these devices is on a 50 Ohm microstrip transmission line. RF performance will vary with the ground plane spacing under the device, as well as with the dielectric constant of any insulating material. Any device parasitic reactance can usually be compensated with external circuitry. In general, for attenuation values of 1 through 8 dB capacitance to ground should be minimized. This can be accomplished by using a thick, low dielectric constant ground plane spacing. For values of 8 dB and higher, the best performance is achieved when the device sits directly on ground. In all cases, grounding is critical. If the device is surface mounted, you must provide plated thru-holes in close proximity to the topside ground pad. Make the input and output termination connections with a low inductance bond. The W3 terminations produce such a bond simply by the design of the wraparound metallization. The W1 terminations are usually connected to the substrate using small tabs or wires. The width of the tab should be equal to the smaller of either the substrate line width or the chip pad size. The WB1 has wire bondable terminations. We recommend a low inductance ribbon bond or multiple wire bonds.
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Application note & Design Guide |
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Please see the document for details |
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10 Oct 2012 |
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