SMF5.0(C)A-SMF170(C)A TVS
2022-07-07
●Features
■For surface mounted applications in order to optimize board space
■Low profile space
■Glass passivated chip
■Low inductance
■Excellent clamping capability
■Very fast response time
■Typical ID less than 1μA at VWM
■200 W peak pulse power capability with a 10/1000 μs waveform
■Component in accordance to
■RoHS 2002/95/1 and WEEE 2002/96/EC
■For surface mounted applications in order to optimize board space
■Low profile space
■Glass passivated chip
■Low inductance
■Excellent clamping capability
■Very fast response time
■Typical ID less than 1μA at VWM
■200 W peak pulse power capability with a 10/1000 μs waveform
■Component in accordance to
■RoHS 2002/95/1 and WEEE 2002/96/EC
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