eMPack A4 Application Kit Technical Explanation
The new eMPack module family integrates Semikron's latest DPD (direct pressed die) and DSS (double side sintering) technology in an ultra-low-inductive module design.
While the DPD technology greatly reduces the thermal package resistance, the DSS technology significantly improves the power and temperature cycling capability. The low-inductive module design allows for higher bus voltages and higher output currents resulting in an increased power density. Thus making the eMPack ideal for all kinds of automotive applications.
This Application Sample Kit offers an easy way to set up power inverters with SEMIKRON's eMPack module family.
The Application Kit shall help users to run performance measurements in the lab, build up first demon strati on inverters, adjust control algorithms and give some guidance how to build an automotive inverter. However, the kit is not intended for field testing.
All Gate Driver Boards (PCBs only, not mounted to Application Kit) have been isolation tested. There is no functional routine test.
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eMP1020MD075SC2SV1DPD 、 eMP780MD12SC2SV1DPD 、 eMP1080GD075ED2V1DPD 、 19285050 、 19285060 、 19285200 、 45152002_01 、 45152003_01 、 45152004_01 、 eMP300-080-APK-DC-CAP 、 eMP900-045-APK-DC-CAP 、 19285400 、 19285401 、 eMP-APK-cooling-trough-V1 、 19285402 |
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eMPack A4 Application Kit 、 eMPack power module 、 Gate Driver Boards 、 DC-link capacitors 、 Cooling trough |
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021-02-05 |
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Revision:04 |
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2.6 MB |
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