R8C/22 Group, R8C/23 Group Renesas MCU

2020-07-24
This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking.
Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group.
The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions are the same.

Renesas

R8C/22R8C/23R8CR5F21226DFPR5F21227DFPR5F21228DFPR5F21226JFPR5F21227JFPR5F21228JFPR5F2122AJFPR5F2122CJFPR5F21226KFPR5F21227KFPR5F21228KFPR5F2122AKFPR5F2122CKFPR8C/2xR5F21236DFPR5F21237DFPR5F21238DFPR5F21236JFPR5F21237JFPR5F21238JFPR5F2123AJFPR5F2123CJFPR5F21236KFPR5F21237KFPR5F21238KFPR5F2123AKFPR5F2123CKFP

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Part#

MCU

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Automotive ]

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Datasheet

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Please see the document for details

Automotive

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48-pin mold-plastic LQFP;PLQP0048KB-A

English Chinese Chinese and English Japanese

Aug 20, 2008

Rev.2.00

REJ03B0097-0200

1.3 MB

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