SMCJ Series
2022-06-06
■FEATURES:
●500W peak pulse power capability at 10/1000μs waveform, repetition rate(duty cycles):0.01%
●Excellent clamping capability
●Low incremental surge resistance
●Typical IR less than 1μA when VBR min>12V
●For surface mounted applications to optimize board space
●Low profle package
●Built-in strain relief
●Typical failure mode is short from over-specifed voltage or current
●Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
●IEC-61000-4-2 ESD 30kV(Air), 30kV(Contact)
●ESD protection of data lines in accordance with IEC 61000-4-2
●EFT protection of data lines in accordance with IEC 61000-4-4
●Fast response time: typically less than 1.0ps from 0V to BV min
●Glass passivated chip junction
●High temperature to reflow soldering guaranteed: 260°C/40sec
●VBR @ TJ= VBR@25°C x (1+αT x (TJ -25))(αT:Temperature Coeffcient, typical value is 0.1%)
●Plastic package is flammability rated V-0 per Underwriters Laboratories
●Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
●Matte tin lead–free plated
●Halogen free and RoHS compliant
●Pb-free E3 means 2nd level interconnect is Pb-free and the terminal fnish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)
●500W peak pulse power capability at 10/1000μs waveform, repetition rate(duty cycles):0.01%
●Excellent clamping capability
●Low incremental surge resistance
●Typical IR less than 1μA when VBR min>12V
●For surface mounted applications to optimize board space
●Low profle package
●Built-in strain relief
●Typical failure mode is short from over-specifed voltage or current
●Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
●IEC-61000-4-2 ESD 30kV(Air), 30kV(Contact)
●ESD protection of data lines in accordance with IEC 61000-4-2
●EFT protection of data lines in accordance with IEC 61000-4-4
●Fast response time: typically less than 1.0ps from 0V to BV min
●Glass passivated chip junction
●High temperature to reflow soldering guaranteed: 260°C/40sec
●VBR @ TJ= VBR@25°C x (1+αT x (TJ -25))(αT:Temperature Coeffcient, typical value is 0.1%)
●Plastic package is flammability rated V-0 per Underwriters Laboratories
●Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
●Matte tin lead–free plated
●Halogen free and RoHS compliant
●Pb-free E3 means 2nd level interconnect is Pb-free and the terminal fnish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)
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