Broadcom PCB Soldering/Assembly Best Practices Application Note
■In the printed circuit board (PCB) assembly industry, flux is commonly used—from cleaning component leads to reflow and wave soldering. Using halide and non-halide flux have their own individual challenges. Halide flux always faces the issue of corrosion on the components during post-assembly processes.
■This application note highlights the effect of halide content in PCBs, and Broadcom® recommended guidelines for PCB assembly operations, including surface mount assembly.
|
|
|
|
|
|
|
Application note & Design Guide |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
June 17, 2021 |
|
|
|
|
|
AV02-4463EN |
|
|
393 KB |
- +1 Like
- Add to Favorites
Recommend
- MeiG Smart Released Wi-Fi 6 Module Adopting Qualcomm‘s Latest Generation QCA6391 Wi-Fi Chipset
- Nextron‘s 1000BASE-T1 Automotive Ethernet Solution：4 way SPE circular connectors
- Custom Smart Home Hub with DSGW-210 IoT Gateway,a Backup Solution of Raspberry Pi 3
- 240+ Global Top IC, Electric Materials Manufacturers Enter Sekorm e-Service Platform to Grow Rapidly in Chinese Market
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
