2SJ-083□-006 3.5∅ PHONE JACK
● INSULATION RESISTANCE BETWEEN ANY ADJACENT OPEN CIRCUIT TERMINAL SHELL NOT BE LESS THAN 100MΩ MEASURED BY 500 VDC MEGGER.
● CONTACT RESISTANCE: 30mΩ MAX.
● INSULATION VOLTAGE WITHSTAND：
▲ JACK SHALL WITHSTAND 500V AC BETWEEN ANY ADJACENT TERMINAL FOR ONE MINUTE.
● UNLESS OTHERWISE SPECIFIED. TEST IS TO BE MADE AT 5-35℃ IN TEMPERATURE AND 45-85% IN HUMIDITY.
▲ BUT, IF ANY VAGUE DATA IS OCCURED ON TEST RESULT, ANOTHER TEST SHALL BE MADE AT 20℃±2℃ IN TEMP., 60-70% IN HUMIDITY.
● LIFE TEST: 5,000 CYCLES MIN. (NON-LOAD)
● INSERTION FORCE: 0.4-2Kg.
● WITHDRAWAL FORCE: 0.3-2Kg.
● AFTER LIFE TEST, CONTACT RESISTANCE: 80mΩ MAX.
● AFTER HUMIDITY TEST, INSULATION RESISTANCE :50MΩ MIN.
● MARKING: MARK " " ON TOP OF CONNECTOR.
● *: SEE "TABLE 1"
● SOLDER HEAT RESISTANCE: WAVE SOLDERING 260℃ 10 SECS.
● TO CONFORM TO THE "SE-01-001" & "ROHS DIRECTIVE"
● GREEN PRODUCT IDENTIFICATION MARK IN JACK:
● GREEN PRODUCT IDENTIFICATION LABEL IN PACKING: G.P. PASS
● FOR WAVE SOLDERING LEAD-FREE PROCESS.
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Outline Dimension Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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8/27'09 |
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REV.C |
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128 KB |
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