CD4148及Chip Zener 等系列产品的端电极，由涂银制程改为真空溅镀镍合金变更通知 (Change The Process Of Electrode Terminal Layer From Coating Silver to Sputtering Nickel-Chromium Alloy Include CD4148 And Chip Zener Series)
●Dear Customers:
■为加强元件端电极的介面附着力及提商承受外来应力，下列元件，自2015、21/1起端电极将由涂银制程改为真空溅镀镍合金。
■In order to strengthen interface adhesion and to withstand external stress in the terminal electrode layer, the following components of terminal electrode layer will be change from coating silver process to vacuum sputtering nickel-chromium alloy process from 2015/2/1.
■制程变更元件为CD4148及CDZ系列: (CD4148WP(N)、CD4148WSP(N)、CD4148WTP(N) 、CDZ55BXXX、 CDZ55CXXX、CDZ55BXXX(S)、CDZ55CXXX(S、 CDZ55BXXX(T)、 CDZ55CXXX(T)、 CDZ55CXXXM、 CDZ55CXXXSM 、CDZ55CXXXTM)
■ECN compounds list (CD4148 And Chip Zener series): (CD4148WP(N), CD4148WSP(N), CD4148WTP(N) , CDZ55BXXX, CDZ55CXXX, CDZ55BXXX(S), CDZ55CXXX(S), CDZ55BXXX(T), CDZ55CXXX(T), CDZ55CXXXM , CDZ55CXXXSM, CDZ55CXXXTM)
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CD4148 Series 、 CD4148 、 CD4148WPN 、 CD4148WSPN 、 CD4148WTPN 、 CDZ55BXXX 、 CDZ55CXXX 、 CDZ55BXXXS 、 CDZ55CXXXS 、 CDZ55BXXXT 、 CDZ55CXXXT 、 CDZ55CXXXM 、 CDZ55CXXXSM 、 CDZ55CXXXTM 、 CD4148WP 、 CD4148WSP 、 CD4148WTP 、 CD4148 系列 、 CDZ 、 CDZ 系列 |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2014/7/29 |
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840 KB |
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