Thermal Fatigue Life of SMT Connector
■We have been evaluated thermal fatigue life for a Sn-Ag-Cu solder joint part and investigated what influence the connector structure gives thermal fatigue life. As a result, it was able to be confirmed that the life shortens when the connector length is long and that degree of its influence, influence of the connector height and so on differs depending on the connector structure [a receptacle and a plug and so on]. Furthermore, it was clarified that there was a possibility that hold down tags which plays an important role for joint strength greatly shorten thermal fatigue life.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2009.3 |
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89 KB |
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