Keeping Defense Platforms Alive in a World of Decreasing Semiconductor Availability Application Note

PublishTime：2022-04-24

●Originally, defense was the main driver of semiconductor design, and the two industries aligned well. In the decades since, the semiconductor business has become dominated by the needs of the commercial sector, with defense usually an afterthought. One consequence of this is that the availability of many commercial semiconductor parts useful to the defense industry can be measured in months, or at most a handful of years. This has a profound impact on the defense industry. In parallel, many countries are also choosing to extend the working life of big defense platforms rather than invest in ground-up replacements. Taken together, these two trends make the sourcing of semiconductors over the long term a major worry. This mismatch is illustrated in Figure 1, where the phases are typically measured in decades. To compound the pain, a significant trend is that many semiconductor manufacturers that formerly supplied the defense and space markets are abandoning the segments in favor of easier, higher volume opportunities such as 5G telecom. This only makes the sourcing of semiconductors worse.
Note that even for new platforms, the time delay between component selection and ramping to volume will be significantly beyond the availability of most commercial parts, so that chip availability impacts new platforms as well..
This paper looks at ways of successfully managing the supply of critical semiconductor parts over the long-term using Teledyne e2v’s Semiconductor Lifecycle Management (SLiM™) program.
●It is certain that semiconductor availability will continue to be a poor match with defense development lifecycles, and lengthening platform extensions. Add into the mix the extra levels of performance, part qualification and custom packaging, and the defense and space industries become unattractive for most semiconductor suppliers, particularly when compared to volume opportunities such as 5G telecoms. However, there are options for ensuring availability of suitable parts in most situations, and this paper has shown some real examples of problems solved. These range from sourcing and die banking, to custom packaging and memory stacking, through to full wafer-up resurrection.

Brand of Product：	Teledyne Defense Electronics
Part#：	LM741 More Part#
Product Category：	Semiconductor More
Application：	[ Avionic Application ][ Helicopter ][ Memory Re-Ball ][ Fighter Aircraft ] More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2020/3/6
Version Number：
Data Encoding：
Data Size：	9 MB

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