LOCTITE ECCOBOND FP4460 Technical Data Sheet
●LOCTITE ECCOBOND FP4460 provides the following product characteristics:
■Technology: Epoxy
■Appearance: Black
■Product Benefits
▲High purity
▲Low stress
▲Improved work life
▲High temperature performance
▲Excellent chemical resistance
▲Excellent moisture resistance
▲High flow
■Cure: Heat cure
■Application: Encapsulant- glob top
■Filler Type: Silica
■Filler Weight, %: 75
■Operating Temperature: -65 to 150°C
■Typical Package Application: Automotive applications, IC memory cards, Chip carriers, Hybrid circuits, Chip-on-board, Multi-chip modules, BGA and Pin grid arrays
●LOCTITE ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type.
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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November 2015 |
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66 KB |
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