LOCTITE ABLESTIK ATB 120U Technical Data Sheet
■LOCTITE ABLESTIK ATB 120U provides the following product characteristics:
▲Technology: Rubberized Epoxy
▲Appearance: Transparent
▲Cure: Heat cure
▲Product Benefits:
◆Non-conductive
◆Fast cure
◆Thin bondline
◆Excellent gap filling ability
◆L2/260°C performance
▲pH: 3.5
▲Application: Die attach
▲Filler Type: Silica
▲Typical Package Application: Die to die stack
▲Carrier Type: Polyolefin
▲Adhesive Thickness: 20μm
▲Carrier Film Thickness: 85μm
▲Total Thickness: 105 μm
▲Wafer Size: 8 and 12 in
■LOCTITE ABLESTIK ATB 120U adhesive film is formulated for use in wafer lamination processess. It combines process ease with the proven reliability.
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[ wafer lamination processess ][ Die attach ][ Die to die stack ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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June 2016 |
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69 KB |
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