PC8548 rev3 migration to lead-free C4 bumps Product Change Notification (GC151551)
■Affected Part Numbers PC(X)8548EFZFUAUJD, PC8548EMZFAUJD-EP
●Reason for Change: Manufacturing Location; Material
●Change Description:
■The assembly line for PC8548 is changing from ASE to Freescale KLM site (Kuala Lumpur Malaysia).
■The C4 die bumps are changing from leaded (90/10 PbSn) to lead free (SAC) die bumps.
■Since Freescale is stopping the manufacturing of the leaded version of this device, the e2v leaded devices with leaded solder spheres (ball) will be manufactured using a deballing/reballing process applied on Freescale lead free devices.
■This change does not affect the fit, form, functions of the part and the electrical characteristics remain unchanged. No impact on reliability is expected.
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PC8548 、 PC8548EFZFUAUJD 、 PC8548EMZFAUJD-EP 、 PCX8548EFZFUAUJD 、 PC8548ExZJxxxD 、 PC8548ExZGxxxD |
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PCN/EOL |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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27 Mai 2015 |
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Rev L |
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GC151551 |
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91 KB |
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