TC2030-MCP-NL-FP FOOTPRINT FOR TC2030-MCP-NL
■No tracks or vias in the shaded keepout area.
■No other track or signal within 0.020'' of any contact pad.
■Do not allow solder paste on the contact pads. It is essential to eliminate any hole in the solder paste-mask( solder stencil) layer. If this is not possible make the contact pads thru-hole with finished hole size of 0.008'' or less.
■To avoid ordering confusion, please specify DNL in your BOM.
■Optional copper pads allow soldering of s/steel alignment pins to underside of board for debugging use.Use stainless steel soldering flux and care to avoid melting the connector.
■Alternatives include the TC2030-CLIP board that grips the s/steel pins from the underside or Mill-Max receptacles P/N 0295-0-15-XX-06-XX-10-0
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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