SMD (SGS) Test Report (SHAEC2201454905)
●SMD
■Client Ref. Information
●GPP Chip;SKY Chip;Lead Frame/Jumper/Lead Wire;Solder Paste/Solder Perform/Solder Wire;Molding Compound(halogen Free 1);Molding Compound(halogen Free 4);Tin Ball
■The above sample(s) and information were provided by the client.
■SGS Job No.
●SP22-001688 - SH
■Date of Sample Received
●20 Jan 2022
■Testing Period
●20 Jan 2022 - 30 Jan 2022
■Test Requested
●Selected test(s) as requested by client.
■Test Method
●Please refer to next page(s).
■Test Results
●Please refer to next page(s).
■Conclusion
●Based on the performed tests on submitted sample(s), the results of Cadmium, Lead, Mercury, Hexavalent chromium, Polybrominated biphenyls (PBBs), Polybrominated diphenyl ethers (PBDEs) and Phthalates such as Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP) comply with the limits as set by RoHS Directive (EU) 2015/863 amending Annex II to Directive 2011/65/EU.
|
|
Test Report |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
07 Feb 2022 |
|
|
|
SHAEC2201454905 |
|
2.2 MB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.