UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification

PublishTime：2022-03-18

●This section describes the packages and pinouts for the UltraScale architecture-based FPGAs in various organic flip-chip 0.8 mm and 1.0 mm pitch BGA packages.
●This packaging and pinout specification user guide is part of the UltraScale Architecture documentation suite available at: www.xilinx.com/ultrascale.

Brand of Product：	Xilinx
Part#：
Product Category：	More
Application：	More
Data Type：	User's Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	August 5, 2021
Version Number：	v1.16
Data Encoding：	UG575
Data Size：	45.3 MB

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