HFC H150-S series Thermal Gap Filler DATA SHEET

PublishTime：2022-03-09

●Thermal gap filler has excellent flexibility insulation, compressibility and natural surface viscosity performances. It used to fill the gap and realize the heat transfer between the heating parts and cooling parts. It also has insulation and shock mitigation effects Meanwhile, it can satisfy the design requirements for minitype and ultra-thin equipments with excellent manufacturability and practicability. With wide range of thickness, it is widely used in electronic products.
●FEATURES:
■Strength and excellent toughness
■High resilience
■UL94V-O recoqnized
■High insulation
■High tear strength

Brand of Product：	HFC
Part#：	H150-S series 、 H150-S More Part#
Product Category：	Thermal Gap Filler More
Application：	[ New energy battery ][ vehicles industry ][ Between chip ][ heat-dissipation modules ][ Optoelectronic Industry ][ Netcom products ][ Wearable equipments ][ electronic products ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2022/1/22
Version Number：
Data Encoding：
Data Size：	348 KB

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