HFC H100-Soft series Thermal Gap Filler DATA SHEET

PublishTime：2022-03-09

●Thermal gap filler has excellent flexibility insulation, compressibility and natural surface viscosity performances. It used to fill the gap and realize the heat transfer between the heating parts and cooling parts. It also has insulation and shock mitigation effects Meanwhile, it can satisfy the design requirements for minitype and ultra-thin equipments with excellent manufacturability and practicability. With wide range of thickness, it is widely used in electronic products.
●FEATURES:
■Ultra-soft, excellent compression performance
■Low thermal resistance
■Being recognized as UL94 V-0
■Viscous surface
■Being able to work under low pressure
■Excellent insulation performance and thermal resistance

Brand of Product：	HFC
Part#：	H100-Soft series 、 H100-Soft More Part#
Product Category：	Thermal Gap Filler More
Application：	[ Between chip ][ heat-dissipation modules ][ Optoelectronic Industry ][ Netcom products ][ New energy battery ][ vehicles industry ][ Household appliances ][ Wearable equipments ][ electronic products ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2022/1/21
Version Number：
Data Encoding：
Data Size：	351 KB

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