HFS-18C series Thermal Gap Filler DATA SHEET

PublishTime：2022-03-09

●HFC HFS-18C is a new type of high-efficiency thermally conductive gasket with high thermal conductivity and high resilience rate. By using an advanced arrangement technology, the high thermal conductivity filler is uniformly and vertically distributed in the polymer matrix, which can greatly improve the efficiency of heat transfer. At the same time, it has good compression resilience, good mechanical properties and excellent thermal stability, and is widely used in electronic fields that require relatively high heat dissipation.
●FEATURES:
■Soft surface, good compressibility
■Low thermal resistance
■Low stress assembly
■Lightweight, high resilience
■Good thermal stability

Brand of Product：	HFC
Part#：	HFS-18C series 、 HFS-18C More Part#
Product Category：	Thermal Gap Filler 、 high-efficiency thermally conductive gasket More
Application：	[ electronic fields ][ Satellite ][ radar ][ military fields ][ Large server ][ Data Processing Center ][ high-performance mobile phones ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2022/1/22
Version Number：
Data Encoding：
Data Size：	424 KB

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