HFS-10 series Thermal Gap Filler DATA SHEET

PublishTime：2022-03-09

●HFC HFS-10 is a high-efficiency thermally conductive gasket with good thermal conductivity and low thermal resistance, which can effectively fill the gap between the heating end and the cooling end, and achieve efficient heat transfer between the heating part and the cooling part Amplitude reduces interface hermal resistance. At the same time, the high-efficiency heat sink can also be used under lower stress conditions to avoid damage to chips, PCBs and other components from mounting stress. The product is extremely technical and usable, and can be used in devices such as photovoltaic modules and Netcom that require.
●FEATURES:
■High thermal conductivity and low therma resistance
■Low stress assembly
■Good thermal stability
■Multiple thickness options, wide range of applications

Brand of Product：	HFC
Part#：	HFS-10 series 、 HFS-10 More Part#
Product Category：	Thermal Gap Filler 、 high-efficiency thermally conductive gasket More
Application：	[ photovoltaic modules ][ Netcom that require ][ Satellite ][ radar ][ military fields ][ Between chip and heat-dissipation module ][ Optoelectronic Industry ][ Netcom products ][ Wearable equipments ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2022/1/22
Version Number：
Data Encoding：
Data Size：	357 KB

Data section preview(1pages)

- The full preview is over,the data is 1 pages -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits