HFC H300-Soft series Thermal Gap Filler DATA SHEET
● HFC H300-Soft series thermal gap filler is a thermal conductive interface material with natural surface viscosity. The product has low thermal resistance, good flexibility and electrical insulation. The product is of natural stickiness and high compressibility, which can fill the gap well and realize the heat transfer from the heating part to the heat dissipation part. At the same time, it also plays the role of insulation and damping, which can meet the design requirements of miniaturization and ultra-thin equipment. It is highly technically usable.
● FEATURES:
■ Ultra-soft, excellent compression performance
■ Low thermal resistance
■ Being recognized as UL94V-0
■ Viscous surface
■ Being able to work under low pressure
■ Excellent insulation performance and thermal resistance
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[ Optoelectronic Industry ][ Netcom products ][ New energy battery ][ vehicles industry ][ Household appliances ][ Wearable equipments ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/1/21 |
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351 KB |
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