ECB Series Multilayer Ferrite Chip Beads
2022-02-24
●FEATURES:
■High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects.
■Different types with the same shape are available.
■Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability.
■Applicable to both flow and reflow soldering.
■High impedance cover wide frequency ranges.
■L material type can minimize attenuation of the signal waveform due to its sharp impedance characteristics.
■High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects.
■Different types with the same shape are available.
■Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability.
■Applicable to both flow and reflow soldering.
■High impedance cover wide frequency ranges.
■L material type can minimize attenuation of the signal waveform due to its sharp impedance characteristics.
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