LOCTITE GC 50 Technical Data Sheet
■ LOCTITE GC 50 provides the following product characteristics:
■ Technology: Solder paste
■ Application: Jetting/Dispensing, Halogen-free, Pb-free soldering
● FEATURES AND BENEFITS:
■ Provides added long-term stability over a wide range of temperature conditions. Cpk >2.0 achievable with less than 50% tolerance
■ High process capability for paste diameter targets of <300 μm using jetting technology
■ Optimized rheology suitable for solder paste jetting technology with process stability up to 28°C (82°F)
■ Stable in ejector head for at least 1 week (up to 28°C/82°F).
■ Suitable for use in time/pressure and auger pump dispensing systems
■ Void-free packaging for improved process consistency and sustainability
■ Stable at room temperature for enhanced sustainability
■ Excellent soldering performance in air or in nitrogen
■ Good resistance to graping in demanding reflow profiles
■ IPC Class III voiding performance
■ Post reflow residues readily removed with electronics industry solvents
■ Compatible with Pb-free printing pastes in a solder additive process
■ Eliminates the need for step-stencil or preforms
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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February 2020 |
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94 KB |
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