End Of Life: Select Glass Package Discrete Semiconductors

2022-02-21
●Due to evolving Environmental Policies, the production of glass package product with lead solder will be discontinued effective immediately. These products will be replaced with lead free glass package products that have the same exact performance and reliability. The following products that are effected are as follows.
●We apologize for any inconveniences this may cause. We believe this is the best way to keep in compliance with many Environmental Standards, including RoHS and REACH.

Surge Components

BAV20BAV20PFLS4148LS4148PFLL4148LL4148PF1N46901N4690PFSL4739ATRSL4739APFTR

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PCN/EOL

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Please see the document for details

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11.15.2021

ISSUE NO.01

20211115

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