Transmission Line MIM Capacitor (Metal-Insulator-Metal)

2022-02-15
●GENERAL DESCRIPTION
AVX Thin Film Technologies is pleased to introduce a novel MIM (Metal-lnsulator-Metal) capacitor using a transmission line wire bond pad structure with backside ground.
The TL MIM can be supplied on quartz, alumina, glass and other substrates to minimize losses. Copper traces are used for optimal conductivity. Front and backside gold metalization make this device suitable epoxy, gold wire bond/ribbon bond attachments.
●BENEFITS
■HFSS Design Unique for every device
■Gold Wirebondable
■Copper Con ductor Desig n fo「improved Circuit Con ductivity
■Desig ns Optimized for RF/Performa nee
■ROHS Compliant

AVX

MV0304CA150MABWMV0402CA150MAAWMV0802CA150MAAWMV0804CA1R0MABWMV0804CA150MABWMV3204CA150MABWMV0404CA150MABWMV0505CA150MQAW

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Part#

Transmission Line MIM Capacitornovel MIM (Metal-lnsulator-Metal) capacitor

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DC Blocking at UHF ]High Frequency Link ]RF Microwave applications ]

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Datasheet

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2020/7/14

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