Handling and Soldering of onsemi TSV Packaged SiPM Sensors

PublishTime：2022-01-30

■INTRODUCTION
●This document contains information on the handling, storage and soldering of the onsemi TSV (through silicon via) packaged sensors.This document applies to the following sensors:
▲MicroFJ-XXXXX-TSV
●where the Xs represent numerals in the part number.Please discuss the contents of this document with your contract manufacturer.

Brand of Product：	ON Semiconductor
Part#：
Product Category：	Sensors More
Application：	More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2021/8/17
Version Number：	Rev. 5
Data Encoding：	AND9793/D
Data Size：	391 KB

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