LOCTITE GC 18 halogen free, no-clean, low voiding, Pb-free solder paste Technical Data Sheet
●LOCTITE GC 18 provides the following product characteristics:
▲Technology：Solder paste
▲Application：Low voiding, Halogen-free, Pb-free soldering
■LOCTITE GC 18 is a halogen free, no-clean, low voiding, Pb-free solder paste specially formulated to provide low voiding when soldering Bottom-Terminated Components (BTC- QFN, DPAK and LGA). This material is also designed to enhance stability in printing applications.
■FEATURES AND BENEFITS
●Low Voiding: < 25% voiding across small and large BTC
●IPC Class III voiding for BGA/CSP
●Excellent soldering performance
●Good resistance to graping in demanding re flow profiles
●Excellent humidity resistance
●Minimal slump at room temperature and up to 190°C
●Process capability: (Cpk) >2.0 for area ratios down to 0.50
●Stable on-stencil viscosity for improved printing consistency
●Reliability: Pass SIR and ECM independent of reflow profile
●Pin-testable post-reflow residues after four reflow cycles
●Compatibility with approved encapsulant technologies
●Stable at room temperature for enhanced sustainability
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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February-2020 |
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101 KB |
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