ALPHA OL-107E SOLDER PASTE FOR FINE PITCH STENCIL PRINTING
● FEATURES & PROCESS BENEFITS:
■ Delivers consistent print performance even after 8 hours of continuous use
■ Excellent fine-feature cosmetics demonstrated by bright, shiny joints
■ Clear, colorless flux residues engineered not to spread onto either the board or components providing satisfactory pin testing
■ Provides fine feature print volume consistency to 0.4mm pitch QFPs even after one hour of downtime
■ Excellent solder spread
■ Exceeds both JIS and IPC requirements for random solderballing
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2005/1/10 |
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SM788-2 |
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298 KB |
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