8.0SMDJ Series Surface Mount – 8000W
2022-01-20
●Description
■The 8.0SMDJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage even
●Features and Benefits
■For surface mounted applications to optimize board space
■Low profile package
■Typical failure mode is short from over-specified voltage or current
■Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
■IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
■ESD protection of data lines in accordance with IEC 61000-4-2
■EFT protection of data lines in accordance with IEC 61000-4-4
■Built-in strain relief
■Glass passivated chip junction
■8kW peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
■Fast response time: typically less than 1.0ps from 0V to VBR min
■Excellent clamping capability
■Compact size with high power density in DO-214AB Package
■Low incremental surge resistance
■Typical IR less than 5μA when VBR min>22V
■High temperature reflow soldering guaranteed: 260°C/40sec
■VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25))(αT:Temperature Coefficient, typical value is 0.1%)
■UL Recognized compound meeting flammability rating V-0
■Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
■Matte tin lead–free plated
■Halogen free and RoHS compliant
■Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD-609A.01
■The 8.0SMDJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage even
●Features and Benefits
■For surface mounted applications to optimize board space
■Low profile package
■Typical failure mode is short from over-specified voltage or current
■Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
■IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
■ESD protection of data lines in accordance with IEC 61000-4-2
■EFT protection of data lines in accordance with IEC 61000-4-4
■Built-in strain relief
■Glass passivated chip junction
■8kW peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01%
■Fast response time: typically less than 1.0ps from 0V to VBR min
■Excellent clamping capability
■Compact size with high power density in DO-214AB Package
■Low incremental surge resistance
■Typical IR less than 5μA when VBR min>22V
■High temperature reflow soldering guaranteed: 260°C/40sec
■VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25))(αT:Temperature Coefficient, typical value is 0.1%)
■UL Recognized compound meeting flammability rating V-0
■Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
■Matte tin lead–free plated
■Halogen free and RoHS compliant
■Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD-609A.01
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