Thermal Characteristics of IC Assembly
●The purpose of this document is to provide a centralized listing of package thermal characteristics (Junction-to-Ambient and Junction-to-Case). This listing is not specific to individual devices sold by Analog Devices; it is representative of typical values for a given package and pin count. When the data sheet for a specific product lists thermal characteristics, that data is correct for that specific device and reflects any thermal enhancements that have been made in the packaging of that device.
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Please see the document for details |
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BGA;CERDIP;CQFP;CSP;CSP BGA;JLCC;LCC;SSOP;TSSOP;SOT23;SOT143;SOIC;SC70;QSOP;QFP;PSOP;PLCC;PDIP;MSOP;LGA;LQFP |
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English Chinese Chinese and English Japanese |
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2021/05/11 |
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REV. 0 |
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