Winbond's W25M Series SpiStack®

2021-12-24
■Winbond is the first company to offer the new SpiStack® W25M Memory Series for “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and data storage, while providing designers with flash solutions most appropriate for their design requirements. SpiStack® architecture offers designers maximum flexibility in tailoring flash solutions to meet their specific memory-density and application requirements. The W25M Series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. W25M memories also feature the popular, multi-IO SpiFlash® interface featuring the popular Serial Peripheral Interface (SPI) and command set.

Winbond Electronics

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SpiStack® Memories

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Supplier and Product Introduction

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WSON8;TFBGA24;SO16

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