Assembly Considerations for Analog Devices mModule®BGA and LGA Packages
■Package Construction for BGA and LGA Package
■PCB Design Guidelines for BGA and LGA Package
●BGA PCB Pad Layout
●LGA PCB Pad Layout
■PCB Design Guidelines –Round Pads for BGA & LGA Package
■PCB Design Guidelines –Square Pads for LGA Package
■Moisture Sensitivity Considerations for BGA and LGA Package
■Solderability Test for LGA Package
■Board Assembly Process for BGA and LGA Package
●Stencil Design
●Screen Print
●LGA μModule Placement Additional Guidelines
●Reflow Profile
●Solder Joint Void
●Cleaning
■Second Side Assembly Guideline for BGA and LGA Package
■Rework for BGA and LGA Package
■BGA Package: Dual Component on Package Handling
■Maximum Mechanical Load for Heatsink Attach
■FAQs
|
|
|
|
|
|
|
Application note & Design Guide |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
BGA;LGA |
|
|
English Chinese Chinese and English Japanese |
|
|
24 June 2020 |
|
|
|
|
|
|
|
|
2.3 MB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
