SP120N No-Flow Prepreg
■High peel strength
■Minimal resin flow, flexible
■Excellent process ability, punching compatible
■Excellent thermal reliability and electrical properties
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[ die cavity board ][ multilayer rigid-flex PCB application ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/12/25 |
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CN-TDS-1810-02-SP120N |
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460 KB |
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