SH260 High Performance, Polyimide Laminate and Prepreg
■Polyimide system
■Ultra-high thermal performance
■Tough resin system, Non-MDA chemistry
■Maintain mechanical strength and bonding strength at high temperature.
■Halogen-free, chemistry and lead-free compatible.
■RoHS/WEEE compliant.
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[ Aircraft ][ Aerospace ][ PCB ][ Bur n-in board ][ Down hole ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019/1/9 |
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CN-TDS-1810-02-SH260/S260HB |
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1.1 MB |
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