HDM®/HDM℗ 2 mm Backplane Connector

2021-12-10
■ Amphenol's HDM/HDMPLUSconnector family follows the modular formata dopted by Amphenol to provide a high degree of design freedom and scalability for board-to-backplane interconnect systems. Daughterboard connector assemblies are constructed using individual modules assembled onto a stainless steel stiffener. Both shielded and unshielded modules can reside on the same stiffener providing design flexibility.
■ HDM's 6-row, 2.0 mm grid spacing provides density of 75 contacts per inch (30 contacts perlinear centimeter). Electrically, HDM can operate in applications with rise times as low as 500 pico seconds. With over 100 million mated signal lines installed, HDM is the proven choice for demanding applications in telecom and datacom.

Amphenol ICC

Backplane Connector

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telecom ]datacom ]Printed Circuit Backplanes ]Integrated Backplane Systems ]Stacking Connectors ]Coax ]Power Modules ]

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Supplier and Product Introduction

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2007

ATCS-004-0307-2.2K

2.4 MB

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