SBT-BGA-6005 Drawing ：SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS
●Features
■Wide temperature range (-55C to +180C)
■High current capability (up to 4A)
■Excellent signal integrity at high frequencies
■Low and stable contact resistance for reliable production yield
■Highly compliant to accommodate wide co-planarity variations
■Automated probe manufacturing enables low cost and short lead time
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Outline Dimension Drawing |
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Please see the document for details |
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BGA324G |
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English Chinese Chinese and English Japanese |
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9/1/20 |
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REV. D |
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637 KB |
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