Basic Thermal Properties of Semiconductors

PublishTime：2021-12-09

●INTRODUCTION
■Three basic processes govern the removal of heat from the rectifier junction to the ambient air: conduction (heat traveling through a material); convection (heat transfer by physical motion of a fluid); and radiation (heat transfer by electromagnetic wave propagation). Heat flows by conduction from the die to the package mounting surface in stud−, base−, or surface−mount pads, but it flows from the die through the leads to the mounting terminals in a lead−mounted part. This thermal conduction can be modeled and designed for, so that the devices in question do not exceed their maximum junction temperatures. Steady state, periodic and transient thermal conditions can all be modeled and solved, allowing the design to maintain proper thermal operating points, ensure device lifetimes and prevent thermal runaway.

Brand of Product：	ON Semiconductor
Part#：
Product Category：	Semiconductors More
Application：	More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	June−2009
Version Number：	Rev. 0
Data Encoding：	HBD856/D
Data Size：	284 KB

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Integrated Circuits