Basic Thermal Properties of Semiconductors
■Three basic processes govern the removal of heat from the rectifier junction to the ambient air: conduction (heat traveling through a material); convection (heat transfer by physical motion of a fluid); and radiation (heat transfer by electromagnetic wave propagation). Heat flows by conduction from the die to the package mounting surface in stud−, base−, or surface−mount pads, but it flows from the die through the leads to the mounting terminals in a lead−mounted part. This thermal conduction can be modeled and designed for, so that the devices in question do not exceed their maximum junction temperatures. Steady state, periodic and transient thermal conditions can all be modeled and solved, allowing the design to maintain proper thermal operating points, ensure device lifetimes and prevent thermal runaway.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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June−2009 |
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Rev. 0 |
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HBD856/D |
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284 KB |
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